NANOSTRUCTURED Ni FILMS BY POLYOL
J. Zhang 1, G.M. Chow 1, S.H. Lawrence 2 and C.R. Feng 2
1 Department of Materials Science, National University of Singapore,
Kent Ridge, Singapore 117543, Republic of Singapore
2 Naval Research Laboratory, Washington, DC 20375, USA
Nanostructured Ni films were deposited on Cu by reducing nickel
acetate tetrahydrate in refluxing ethylene glycol at about 194 °C.
The effects of deposition time (t) and Pt as nucleating aid were investigated
in this polyol process. The solution chemistry varied with t. At longer t,
corrosive attack of the solvent on deposited films led to dissolution and re-deposition of Ni.
Saturation magnetization increased with t and decreased with increasing Pt precursors.
The deposited Ni films were magnetically saturated. They showed in-plane magnetization anisotropy
and perpendicular coercivity anisotropy. The use of Pt caused rapid
powder precipitation but did not enhance film deposition. The Pt-catalyzed Ni films showed a (200)
texture and a higher squareness ratio.
full paper (pdf, 92 Kb)