Rev.Adv.Mater.Sci. (RAMS)
No 3, Vol. 33, 2013, pages 287-290


Young Moon Lee, Seung Gyu Jang and Eun Suk Jang


In this study, up and down surface plunge grinding tests have been carried out in polycrystalline silicon workpieces. In the tests resin bonded diamond wheels of different abrasive grain size were used under varying conditions of cutting depth and workpiece velocity. Experimental results show that the specific grinding energy decreases as the maximum undeformed chip thickness increases regardless of abrasive grain sizes and modes of grinding. The surface roughness with larger grain size is greater than that with smaller one. In the case of 120 mesh grain, the magnitudes of surface roughness for up grinding are distinctly greater than those for down grinding.

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