Rev.Adv.Mater.Sci. (RAMS)
No 1, Vol. 46, 2016, pages 22-38

A REVIEW ON RECENT PROGRESS OF R&D FOR HIGH-TEMPERATURE RESISTANT POLYMER DIELECTRICS
AND THEIR APPLICATIONS IN ELECTRICAL AND ELECTRONIC INSULATION

Xiu-Min Zhang, Jin-Gang Liu and Shi-Yong Yang

Abstract

High-temperature resistant polymer dielectrics (HTPDs) have been finding great applications in electrical and electronic insulating fields due to their excellent thermal stability at elevated temperatures, good dielectric properties over wide temperature and frequency ranges, good mechanical properties, and high environmental stability, etc. The latest progress of research and development on HTPDs has been reviewed in the present paper. The developing history, structural features, molecular design, and functionalization for typical aromatic or heteroaromatic HTPDs, including imide polymers [polyimide (PI), polyamideimide (PAI), and polyetherimide (PEI)], polybenzimidazole (PBI), polybenzoxazole (PBO), polyetheretherketone (PEEK), and polyphenylquinoxaline (PPQ) have been summarized. Then, the applications of HTPDs in electrical and electronic insulating areas were introduced. The future developing trend for HTPDs was prospected at last.

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